Damage evaluation is possible through charge-up from dry etching, plasma CVD, sputtering, and ion implantation.
Our company provides solutions for test wafers backed by advanced semiconductor technology, comprehensively supporting the evaluation and development of our customers' equipment, materials, and processes. The service for evaluating charge-up damage is available for 12-inch wafers and has been globally recognized for a long time. We can evaluate charge-up for dry etching, plasma CVD, sputtering, and ion implantation. We support wafer sizes of 300mm, 200mm, and chip measurements, measuring wafers treated with plasma in our customers' equipment and providing data for I/V curves and Vbd maps. Additionally, TDDB (Qbd) measurement services are also available. *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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Delivery Time
P4
※The delivery time may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
We are being utilized by semiconductor equipment manufacturers both in Japan and overseas.
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Company information
Our company has been continuously supporting our customers' technology and product development with advanced semiconductor technology using test wafers for over 20 years. Our know-how and experience have transcended the boundaries of semiconductor manufacturing and culminated in the development of the gas instant heating component, the "Heat Beam Cylinder." This technology is expanding its application not only in the semiconductor field but also across various industrial sectors, demonstrating its achievements and effectiveness. If you have any technical inquiries or product requests, please feel free to contact us at any time.