Introduction of technology

Processing products that require strict precision with a single chuck! Cultivating technology that can sufficiently handle mass production.

We would like to introduce our processing technology. For optical device components that require a hole accuracy of within 10 microns along the optical axis relative to the reference plane, we use "machining," while high-performance components related to semiconductors are processed using "lathe machining." Both products are critical components for optical devices and semiconductor equipment that demand strict precision. We have developed technology that allows for the processing of these precision products in a single chuck setup, making it suitable for mass production. 【Processing Examples】 < Machining > ■ Optical device components ■ Material: Cast iron ■ Hole accuracy of within 10 microns along the optical axis relative to the reference plane is required. *For more details, please refer to the related links or feel free to contact us.

Other semiconductorsOther optical partsProcessing Contract