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  6. Notice of Participation in SEMICON JAPAN

Notice of Participation in SEMICON JAPAN

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last updated:Nov 17, 2023

三星ダイヤモンド工業
三星ダイヤモンド工業
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We will be exhibiting at 'SEMICON JAPAN' held at Tokyo Big Sight (East Exhibition Hall) from December 13 (Wednesday) to 15 (Friday), 2023!

On the day of the exhibition, we plan to demonstrate the standalone machine "DIALOGIC DS Series," which consolidates the chip-making process of semiconductor wafers into a compact body. We will also introduce processing technologies for the chip-making process of cutting-edge SiC wafer semiconductor devices.

    Wafer
image-C_人なし_231108-300x212.jpg

Notice of Participation in SEMICON JAPAN

image-C_人なし_231108-300x212.jpg
image-C_人なし_231108-300x212.jpg
  • Related Link - https://www.mitsuboshidiamond.com/dialogic/

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basic information

● Overview ● 【Dates】December 13 (Wed) - 15 (Fri), 2023 【Time】10:00 AM - 5:00 PM 【Venue】Tokyo Big Sight (East Exhibition Hall) 【Booth】Hall 7, 7440 ● Exhibition Content ● Processing technology applied to the chip manufacturing process of cutting-edge semiconductor devices High-precision cutting of SiC wafers using MDI's unique SnB (Scribe & Break) method Live demonstration of the "DIALOGIC DS Series" A standalone machine that consolidates the chip manufacturing process of semiconductor wafers into a compact body We understand you may be busy, but we kindly ask you to visit our booth.

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● Contact Information ● Mitsubishi Diamond Industrial Co., Ltd. Semiconductor Solutions Sales Department 32-12 Kōroen, Settsu City, Osaka Prefecture 566-0034 TEL: 072-648-5587

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  • 20231115-1-768x312

    No chipping, no car floss ultra-narrow street, high productivity, dry process.

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三星ダイヤモンド工業

三星ダイヤモンド工業

Industrial Machinery

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Samsung Diamond Industrial is a manufacturer of processing equipment that provides optimal process conditions using original cutting edges and laser oscillators for processing methods such as scribing, breaking, drilling, and patterning, along with automated devices that achieve high productivity. Since its establishment in 1935, the company has utilized its "high-quality cutting technology for various types of glass" to offer processing processes, equipment, and tools that can handle "all kinds of hard and brittle materials, as well as multilayer structures that include metals and organic materials." With solutions backed by theory and proven results, we aim to be a reliable "one-and-only partner" for our customers. Please feel free to contact us.

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