Cut the processed cylindrical ingot into cones, blocks, and samples.
The "SMB-812-40280" is a semiconductor automatic cutting machine that performs the separation of both ends of long silicon ingots using a band saw, as well as cutting to specified block sizes and sampling cuts for each block. Laser/ink printing can be applied to blocks and samples, and a LAN connection system for logistics sorting is also possible. Additionally, fully automatic loaders and unloaders can be accommodated based on specific requirements. Please feel free to contact us if you have any requests. 【Specifications】 ■ Ingots size: 8", 12" × 2,800l / 500kg ■ Block length: 100–450mm ■ Sample thickness: 1.2–5.0mm ■ Utility: 10kVA / 220V / 50A / 60Hz ■ Dimensions a b h: 8,200 / 4,650 / 3,500mm ■ Machine weight: 19,400kg *For more details, please download the PDF or feel free to contact us.
Inquire About This Product
basic information
For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Our company is engaged in the design, manufacturing, and system development of silicon and compound semiconductors, glass processing, various specialized machines for the aerospace and automotive industries, and precision equipment. We have a well-equipped factory infrastructure. With a factory height of 9 meters and a 7.5-ton crane, we have ample space for the assembly of large equipment. Additionally, we handle precision machining finishing and three-dimensional inspections in-house in a temperature-controlled room. Currently, we are developing a mass production device for vertical glass polishing. We have a track record of selling CNC centers for glass grinding. If you are interested, please feel free to contact us. As a manufacturer of various specialized machines and equipment, we will continue to strive for further evolution. If you have any inquiries or questions, please do not hesitate to reach out. 【Some Achievements】 Semiconductor-related: Polishing machines, cutting machines, and measuring machines with over 80% global market share. Automotive-related: Automatic press-in machines, large cutting machines. Industrial-related: Powder coating machines, various slings, power control units, touch panel boxes. Aerospace-related: Specialized tube cutting machines, inspection benches, etc.
![[Ultra-precision coating system that can draw lines of 1 micron] [Circuit correction]](https://image.mono.ipros.com/public/product/image/2f1/2001523282/IPROS7271321177747457440.jpg?w=280&h=280)
