"Even warped substrates can be uniformly heated" By adopting a clamp structure, it is possible to uniformly heat while suppressing warping of the substrate!
When heating the substrate in processes such as FOPLP and FCBGA, we are troubled by the issue of "warping during heating." The device that solves this "warping during heating" is the "Clamp-type HP device." 【Features】 ■ Adjustable clamping time, force, and timing ■ Plate temperature: ±1℃ *For details, please request materials or view the PDF data from the download.
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basic information
- Application of our technology for HP heating devices for LCD and OLED glass - Temperature data acquisition tests are possible with our pilot equipment *For details, please request materials or view the PDF data from the download section.
Price information
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Delivery Time
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Applications/Examples of results
【Usage】 〇 Semiconductor package applications such as FOPLP and FCBGA
Company information
Aiming to become a technology development company, we are focusing our efforts to solidify our position in the LCD and semiconductor markets. With a proper understanding of market needs and responsiveness, we will provide products that meet our customers' demands. Additionally, we aim to develop environmentally related products for future business and strive to build a system that contributes to society.
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