Ultrafine circuit formation (fine pitch/fine pattern)
Our company offers proposals for the prototyping and mass production of flexible substrates, not only through etching and plating technologies for printed circuit boards but also through various thin film deposition processes for metal conductors using vacuum deposition and sputtering techniques, applying technologies across different industries. We support not only circuit formation using subtractive methods but also fine wiring with the Modified Semi-Additive Process (MSAP). Primarily focusing on circuit formation on flexible substrates such as transparent flexible substrates, we also provide patterning processes for glass, film ITO, and metal films, combining thin film formation technology, etching technology, and plating technology in our proposals. Additionally, we accommodate fine pattern processing for the formation of micro and narrow pitch bumps, as well as redistribution layers (RDL) for wafer-level packages (WLP).
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basic information
Etching, plating, MSAP, vacuum deposition, EB deposition, sputtering, thin film formation, photolithography, ion plating, thermal CVD, plasma CVD, dry etching, film ITO, film metal patterning, fine pattern, WLP, silicon wafer, RDL, bump formation, TEG, dry etching, wet etching, MEMS, organic EL, metallization, glass etching, semi-additive, printed circuit board, flexible substrate, FPC, flexible substrate, plating, solder, narrow pitch, transparent flexible, transparent resist, transparent.
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Applications/Examples of results
Etching, plating, MSAP, vacuum deposition, EB deposition, sputtering, thin film formation, photolithography, ion plating, thermal CVD, plasma CVD, dry etching, film ITO, film metal patterning, fine pattern, WLP, silicon wafer, RDL, bump formation, TEG, dry etching, wet etching, MEMS, organic EL, metallization, glass etching, semi-additive, printed circuit board, flexible substrate, FPC, flexible substrate, plating, solder, narrow pitch, transparent flex, transparent resist, transparent.
Company information
Sartec is a manufacturing support company based in Hamamatsu City, Shizuoka Prefecture, focused on flexible circuit board design. Going beyond our core strength and origin in "flexible circuit board design," we provide support tailored to each stage of development, from initial development to mass production, including software/hardware development, enclosure design, prototype evaluation, and manufacturing support. Printed circuit boards are an essential component often referred to as the "heart" of a product. Because we have a deep understanding of this core part, we can create a development process with minimal setbacks through our approach of "manufacturing that considers the user's experience" combined with "process design capabilities that encompass the entire product," turning the ideals of researchers and developers into tangible reality. At Sartec, we have a wide range of achievements across various fields, from cutting-edge special designs in medical and aerospace sectors to everyday products like automobiles and IoT appliances. We are also flexibly responding to the semiconductor field, which has been gaining attention in recent years, expanding the possibilities of technology through processes like film formation. If you have a desire to challenge conventional industry norms and pursue products or new technologies that do not yet exist in the world, please feel free to consult with Sartec.
