Highly acclaimed CREST ULTRASONIC products for cleaning in the precision cleaning field, particularly for cleaning hard disk components.
"Hi-Frequency" is a high-efficiency ultrasonic unit that has successfully achieved very low impedance characteristics for the third harmonic wave by adopting a ceramic stack. It reduces the load on the power supply and realizes efficient oscillation characteristics. In examples of cleaning results for hard disk components, it is evident that the particle size that can be removed increases as the frequency becomes higher compared to other frequencies. 【Features】 ■ Adoption of ceramic stack ■ Reduction of load on the power supply ■ Realization of efficient oscillation characteristics *For more details, please refer to the PDF document or feel free to contact us.
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【Specifications】 ■ Oscillator Frequency: 132kHz (192kHz) ■ Oscillator Output: Maximum 2,500W * 500W × 5 modules ■ Output Adjustment Range: 40 to 100% ■ Oscillator Size ・2,500W Module: 17.5" × 16" × 9.25" ・500W Module: 9.25" × 16" × 9.25" ■ Ultrasonic Sweep: ±5.5kHz (±7.5MHz) ■ Power Supply: AC200V single phase 50/60Hz ■ Others: Remote ON/OFF, abnormal signal output, ultrasonic output terminal included * For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.
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