ASMPT is a backend equipment manufacturer based in Singapore.
Kanematsu PWS has been the domestic agent for ASMPT since 2020, primarily introducing ASMPT's die bonders and various back-end equipment to domestic customers. We also provide continuous engineering support after the equipment installation. Features of ASMPT: - A wide range of back-end equipment handling, from plating solutions to dicing, die bonding, wire bonding, molding, and SMT. - Global track record of installations. - Continuous investment of 10% of total sales into equipment research and development. - Provision of engineering support both domestically and internationally. - Particularly strong lineup in die bonding equipment, offering a wide range of equipment proposals.
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basic information
Main Products Handled by ASMPT 〇 Laser Dicing Equipment: Multi-laser dicing using patented technology. High-speed dicing without damaging the wafer. 〇 Die Bonding Equipment: Handling high-speed machines, high-precision machines, and various bonding methods with widths from 0.2μm to 25μm. - Ultra-High Precision Die Bonder (Flip): Alignment with a maximum precision of 0.2μm. - Clip Bonder: Flexible pickup functionality. - Soft Solder Bonder: Solder dispensing method using patented technology. - Multi-Chip Bonder: Bonding multiple types of chips onto a single substrate in one pass. - High-Speed Eutectic Bonder: Precision of 7μm with mirage prevention during heat-up. - 12-Inch Wafer Compatible Bonder: Equipped with rich inspection features. - Bonder for Advanced Packages: TCB, pick and place, hybrid bonder. - Sorter: Ultra-fast sorting. - Mass Bonder: Bulk bonding of multiple types of chips. 〇 Wire Bonder: High-speed bonding using patented technology. 〇 Sintering Equipment: Press method using patented technology. - Die Tacking Equipment: Flexible tacking.
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Applications/Examples of results
LiDAR, vehicle-mounted LED, LED display, MiniLED/MicroLED, CMOS image sensor, sintering, EV, power package, IC discrete, silicon photonics, 5G, data center, smart glasses, advanced package 2.5D/3D, hybrid bonder, memory, MEMS, wearable products, RFID, crystal oscillator, optical communication, IC power-related, MEMS sensor, etc.
Company information
Our company started in 1982 as a technical trading company specializing in the sales and maintenance services of semiconductor manufacturing equipment imported from overseas, as a group company of Kanematsu Corporation. Recently, in order to meet the diverse needs of our customers, we have been committed to ensuring that not only manufacturing equipment but also overseas products such as parts, materials, and subsystems can be used with confidence by our customers. While being a trading company, we have enhanced our technical department, which is responsible for planning, development, design, and manufacturing, to propose comprehensive technical solutions and expand our business globally to customers both domestically and internationally. In the future, we aim to continue being a company that provides new added value and services as an electronics technology trading company, growing together with our customers.