Etching and film deposition for a wide range of markets, including fault analysis, MEMS, optical MEMS, and advanced packaging, are possible!
The "Shuttleline200 Series" is a flexible and multipurpose platform for etching and PECVD applications. By adopting a unique shuttle concept, it enables handling of samples in various sizes, from small pieces to full wafers, providing a multipurpose etching and deposition solution. It also allows for plasma processing technologies such as RIE, ICP, PECVD, and ICP-CVD, offering suitable processing for R&D applications and small-scale production. Specifically, it can perform etching and deposition for a wide range of markets, including failure analysis, MEMS, optical MEMS, advanced packaging, and processes for power semiconductors. 【Features】 ■ Easily adaptable to a wide variety of substrate shapes and sizes due to the unique shuttle concept. ■ User-friendly equipment with a wealth of options and high upgradeability. ■ Multipurpose capability to meet advanced and specific requirements such as RIE and ICP etching. *For more details, please feel free to contact us.
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basic information
【Other Features】 ■ A deposition process with very low contamination made possible by a unique pressurized PECVD concept ■ A flexible platform compatible with RIE etching, ICP etching, PECVD, and ICP-CVD modules ■ Flexible handling that accommodates small pieces as well as 2, 4, 6, or 8 full wafers, enabled by a unique shuttle concept ■ Option to choose between open load or load lock methods ■ Use of fluorine-based and chlorine-based gases is possible ■ A process that eliminates cross-contamination through the use of easily replaceable liners and other components ■ Contamination-free in-situ plasma cleaning is possible *For more details, please feel free to contact us.
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Applications/Examples of results
【Usage】 ■ Used for dry etching during fault analysis ■ Used in R&D or small-scale production for applications such as Si, compound semiconductors, and MEMS, including RIE, ICP dry etching, PECVD, and ICP-CVD processes ■ Used in processes that accommodate a wide range of substrate sizes from small pieces to 8-inch full wafers *For more details, please feel free to contact us.
Company information
Our company offers etching, film deposition, and cutting equipment utilizing plasma technology, as well as the sale of ICP, RIE, DSE, IBE, IBD, PECVD, HDPCVD, and HDRF F.A.S.T.-ALD equipment, along with customer service related to these devices. Plasma-Therm LLC, headquartered in Florida, USA, was established in 1974. Since its founding, it has been manufacturing and selling semiconductor manufacturing equipment utilizing plasma technology for 48 years. Please feel free to contact us for inquiries. ▼ Group company Corial official website https://corial.plasmatherm.com/en
