High-Density Radical Cleaning Solution

We will be exhibiting at the technical exhibition corner of the "MEMS Engineer Forum 2025" to be held from April 16 to 17, 2025. <Exhibition Contents> 1. Introduction of low-temperature, low-damage etching and cleaning equipment using high-density radicals. Our patented HDRF technology eliminates yield issues in MEMS. 2. Introduction of processing technology (ion beam etching) essential for future high-frequency devices and high-speed optical modulation waveguide processing. Ion beam etching is optimal for processing multilayer structures, allowing for angle adjustment of the processing surface and roughness adjustment of sidewalls. 3. Introduction of plasma etching and film deposition equipment suitable for batch processing of compound semiconductors. Multiple wafers can be loaded onto a "shuttle" (wafer carrier) for batch processing. This equipment is suitable for small-scale production. We look forward to your visit.