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  6. Electroless plating process for insulation circuit boards for power semiconductors.

Electroless plating process for insulation circuit boards for power semiconductors.

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last updated:Nov 14, 2024

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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The optimal electroless plating process for the base layer when joining power modules using soldering or silver sintering.

In recent years, SiC and GaN devices have garnered attention as next-generation power semiconductors (power modules) capable of high-temperature operation, with these next-generation power modules expected to operate continuously at temperatures above 200°C. Our company has developed a sulfur-free, low-phosphorus electroless nickel plating solution, "ICP Nicoron LPW-LFN," which minimizes nickel diffusion into solder even in high-temperature environments, thereby maintaining joint reliability. Additionally, sintering bonding using silver particle paste is gaining attention as a high-heat-resistant bonding method to replace traditional solder joints. We have newly developed an electroless silver plating solution, "Top Silver ACC / Top Silver AG," which helps suppress corrosion of the base metal and contributes to improved bonding strength.

    Chemicals
パワー半導体向け絶縁回路基板用 無電解めっきプロセス.png

Electroless plating process for insulation circuit boards for power semiconductors.

パワー半導体向け絶縁回路基板用 無電解めっきプロセス.png
パワー半導体向け絶縁回路基板用 無電解めっきプロセス.png

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We are developing various plating and surface treatment chemicals and high-performance products for automobiles, electric vehicles, home appliances, and various electronics, so please feel free to contact us.

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Power semiconductor (power module)

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Electroless plating process for insulation circuit boards for power semiconductors.

Electroless plating process for insulation circuit boards for power semiconductors.

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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