Introduction to wire bonding, bump bonding, and flip chip bonding!
This document includes information on "High-Density Packaging Specifications." It provides a list of materials, wire diameters, pad sizes, pitches, and other details related to the wire bonding process in wire assembly. Additionally, information on bump assembly and flip chip assembly is also presented in table format. Please feel free to consult us about any content not listed in the provided sizes. [Contents Included] ■ Wire Assembly ■ Bump Assembly ■ Flip Chip Assembly *For more details, please download the PDF or feel free to contact us.
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This is a company that handles contract manufacturing and sales of image monitoring systems, electronic devices, and system in package located in Okaya City, Nagano Prefecture.