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  5. Other measurement, recording and measuring instruments
  6. Probe Card Inspection "AOP-PCI"

Probe Card Inspection "AOP-PCI"

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AOP-PCI

last updated:May 16, 2025

マーポス
マーポス
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High-precision 3D surface measurement to meet the demands of complex surface measurements.

AOP-PCI (Probe Card Inspection) is a multifunctional, non-contact, non-destructive inspection tool designed to comprehensively check probe cards. By combining an air bearing stage with state-of-the-art sensors and vision systems, it can obtain high-precision data on the tips, head shapes, and PCB surfaces of full-size square direct dock probe cards. Additionally, dedicated measurement algorithms enable seamless execution of both data acquisition and analysis routines. *For more details, please refer to the PDF materials or feel free to contact us.*

    WaferSemiconductor inspection/test equipmentOther measurement, recording and measuring instruments
Solarius_AOPPCI_00s.jpg

Probe Card Inspection "AOP-PCI"

Solarius_AOPPCI_00s.jpg
Solarius_AOPPCI_00s.jpg Solarius_AOPPCI_01s.jpg Solarius_AOPPCI_02s.jpg Solarius_AOPPCI_03s.jpg
  • SOLARIUS AOP-PCI
  • Special site - Product/service details - https://pr.mono.ipros.com/marposs/product/

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basic information

Resolution: Horizontal resolution: 1 μm or more, vertical resolution: 1 nm or more Scan speed: Processing time for 30 x 30 mm probe chip array: less than 4 minutes (high resolution), processing time for 80 x 80 mm probe head shape: less than 3 minutes (low resolution) Dimensions: Made to order Changeover time (between different types of probe cards): less than 2 minutes *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

<Representative Applications> • Probe chip/pin inspection Height, diameter, misalignment, presence, debris/particles, coplanarity, damage, tilt • Probe head inspection - loose/chipped screws Contour, shape, debris/particles, detection of defects/damage • PCB inspection Shape, missing components, coplanarity, debris/particles, defects • Probe mark inspection Depth, position, damage to pad edges, shape, particles *For more details, please refer to the PDF document or feel free to contact us.

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Probe Card Inspection "AOP-PCI"

Probe Card Inspection "AOP-PCI"

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Notice of Participation in SEMICON JAPAN 2024

  • Seminar・Event

Our company will exhibit at "SEMICON JAPAN 2024," which will be held at Tokyo Big Sight starting December 11, 2024 (Booth number: 2705). At this exhibition, we will introduce semiconductor industry-specific applications and non-contact measuring instruments that contribute to the reliability of the ever-evolving semiconductor manufacturing process and the improvement of semiconductor performance. We cordially invite you to visit our booth and take a look at our offerings. Exhibited products: - Non-contact thickness measurement gauge (interferometry technology) - Contact/non-contact (confocal technology) hybrid applications - Optical 3D surface roughness and shape measuring instruments - High-end 3D surface measurement for probe card inspection - Visual blade inspection system for dicing processes

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マーポス

マーポス

Testing, Analysis and Measurement

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Marpos Co., Ltd. was established in 1970 as the Japanese subsidiary of the Italian Marpos Group, aiming to be a partner in global manufacturing. For over 50 years, we have been providing precision measurement, inspection, and process management systems used during and after machining in manufacturing processes. We are a main supplier to major automotive manufacturers for both ICE (internal combustion engine) and EV (electric vehicle) and also extend our services to the semiconductor, aerospace, medical, energy, and home appliance industries. Regardless of the size or industry of our customers, we continue to boldly contribute to quality improvement, rationalization, flexibility, and productivity enhancement with Marpos's technology and know-how. Furthermore, in line with Marpos's corporate philosophy, we strive for total quality improvement, have obtained ISO 9001:2015 certification, and conduct design, manufacturing, and assembly in Japan. We have six domestic locations and two overseas locations, providing closely connected services to local customers.

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