Achieving improved precision in microfabrication and enhanced work efficiency! Surface modification with non-contact laser!
In the microfabrication process of semiconductor manufacturing, the removal of dirt and oxides from component surfaces is a critical issue. Conventional cleaning methods raise concerns about damage from polishing and chemicals, as well as environmental impact. The Laser Cleaner FL-LC series addresses these challenges with non-contact cleaning using a high-power laser beam. 【Application Scenarios】 - Microfabrication process in semiconductor manufacturing - Removal of dirt and oxides from component surfaces - Polishing of fine irregularities - Surface treatment before adhesion - Surface modification of substrates and devices - Surface hardening treatment - Adjustment of surface roughness - Pattern formation 【Benefits of Implementation】 - Achieves faster and higher quality surface treatment compared to conventional cleaning methods - Minimizes damage to components, contributing to improved product quality - Reduces environmental impact - Cost reduction through improved work efficiency
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【Features】 - Non-contact cleaning using high power density laser beam irradiation - Minimizes damage to the base material while achieving high-precision surface modification - Compatible with both manual and fixed operations, focusing on ease of use in the workplace - AC100V power supply compatible, suitable for various installation locations - Lens options available to accommodate various workpieces - Low maintenance design with minimal consumables Our Strengths - Extensive experience and track record in production, manufacturing, and processing fields - Providing optimal solutions tailored to customer needs - Customization support for software and hardware - Conducting work tests and on-site demonstrations - Rapid support system
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