[Column] What is Etching? Explanation of Two Types of Methods and Their Advantages and Disadvantages

What is etching? We will explain two types of methods along with their advantages and disadvantages! / Leave the design of electrical and electronic circuits, as well as printed circuit boards, to Nippo! /

In semiconductor manufacturing, a processing precision at the nanometer (nm) level is required, which involves a process called "etching" to process thin films formed on substrates. Etching is a process that utilizes chemical reactions (corrosive effects) of chemicals or ions to shape the thin films (such as oxide films) formed on the substrate into desired shapes. It can be broadly divided into two types: "wet etching" and "dry etching." ■ Wet Etching This method involves immersing the semiconductor substrate in an acidic or alkaline solution to remove unwanted thin films. Advantages: Low cost and high productivity Disadvantages: Not suitable for fine processing (It is used in some processes such as coarse processing or complete removal of thin films.) ■ Dry Etching This method exposes the semiconductor substrate to reactive ion gas or plasma gas to remove unwanted thin films. Advantages: High processing precision Disadvantages: Higher cost and prone to damage Nippo offers a wide range of services from the design of electrical and electronic circuits to the design of printed circuit boards. We can provide proposals tailored to our customers' needs, so please feel free to consult with us.

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