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  4. Semiconductor Manufacturing Equipment
  5. Bonding Equipment
  6. Optical Bonding System "Model: DF1"

Optical Bonding System "Model: DF1"

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last updated:Jul 01, 2025

オリジン
オリジン
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It is possible to apply to various product designs such as rectangular, circular, irregular shapes, flat, 2.5D, and 3D curved surfaces!

The "Model: DF1" is a device that bonds cover glass and display using liquid adhesive (OCR) in an atmospheric pressure environment. By utilizing a unique resin application pattern, our proprietary voltage application technology, and precise gap control, it achieves stable bubble-free bonding. It can be applied to various product designs, including rectangular, circular, irregular shapes, flat, 2.5D, and 3D curved surfaces. 【Features】 ■ Construction of flexible application patterns ■ Precise gap control ■ Suitable UV pre-curing system + process *For more details, please refer to the related links or feel free to contact us.

    Bonding Equipment
?DF1

Optical Bonding System "Model: DF1"

?DF1 画像.jpg
?DF1 画像.jpg
  • Related Link - https://www.origin.co.jp/product/detail/?product_i…
  • Special site - Product/service details - https://pr.mono.ipros.com/s_origin/product/

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basic information

【Lineup】 ■Model 1 (Manual) ■Model 2 (Manual) ■Model 3 (Semi-Automatic) *For more details, please refer to the related links or feel free to contact us.

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Applications/Examples of results

【Applications】 ■ Mobile devices (smartphones, tablets) ■ Lenses/waveguides for wearable devices (VR lenses, AR lenses, MR lenses) ■ In-vehicle displays (cluster, center information display [CID]) ■ Automotive exterior (window glass) ■ Industrial displays (medical, cooking equipment) *For more details, please refer to the related links or feel free to contact us.

Company information

オリジン

オリジン

equipment

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Our company manufactures and sells power supply equipment, semiconductor devices, precision mechanical components, system equipment, and synthetic resin coatings. Leveraging our strengths through a five-business structure consisting of precision mechanical components, coatings, power supply devices, bonding/coating equipment, and power semiconductors, we engage in "proposal-based product development" that values communication with our customers. Additionally, through consulting and dialogue during the development process, we not only meet the functions requested by our customers but also provide new satisfaction with added value.

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