Simultaneous non-contact cleaning of both sides of the wafer, even for submicron particles.
Introducing the "SpinSonic Cleaner," which achieves high cleaning capability through the adoption of a wafer horizontal placement and sheet-fed fine jet method. It can remove sub-micron particles, reduce the number of processes, and eliminate the need for chemical management and heaters. It demonstrates excellent performance that enables a reduction in cleaning time and savings in running costs. 【Features】 - High cleaning capability achieved with chemical-compatible fine jets and 400kHz fine jets - Maintenance-free and damage-free cleaning through non-contact (brushless) cleaning - Capability to perform all cleaning and drying processes in one stage - No need for heaters due to a completely ambient temperature process, significantly reducing power consumption - Compact installation area and high layout flexibility achieved through function-specific unit configuration *For more details, please refer to the related links or feel free to contact us.
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For more details, please refer to the related links or feel free to contact us.
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【Applications】 ■ Cleaning before and after epitaxy ■ Cleaning after CMP ■ Cleaning after polishing ■ Cleaning before annealing ■ Cleaning before and after film formation such as CVD, nitride films, and oxide films *For more details, please refer to the related links or feel free to contact us.
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Our company develops, designs, manufactures, and sells various equipment tailored to customer applications and manufacturing lines in the semiconductor, photomask, disk, and lens industries. We specialize in customized production based on customer specifications, providing total support for the product lifecycle from design, development, assembly, inspection, installation, to maintenance. By building close relationships with customers at every stage, we can directly sense the issues and technological trends they perceive, allowing us to quickly initiate development in response.