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  4. Semiconductor Manufacturing Equipment
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  6. Micro Ball Inspection Repair System for Substrates BM-2150SR

Micro Ball Inspection Repair System for Substrates BM-2150SR

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last updated:Mar 25, 2026

日精 本社
日精 本社
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Reliable solder ball repair is performed using high-speed image processing and a uniquely developed repair unit.

A microball inspection and repair system capable of handling a wide range of sizes, from strip substrates to large panels. It also supports simultaneous inspection of two types of differently sized balls, assisting in achieving high implementation quality. 【Features】 ■ High-speed inspection of ball missing, excess balls, and pitch using an inspection camera (150Mx1) Supports inspection of two types of differently sized balls ■ Two types of repair support ・(a) Ball missing: Ball placement after applying flux ・(b) Excess balls: Removal by nozzle suction ■ An image processing system that follows the expansion of the C4 area due to the increase in package size ■ Compatible with SECS/GEM and AGV (optional) *For more details, please refer to the PDF document or feel free to contact us.

    Semiconductor inspection/test equipment
BM-2100SI

Micro Ball Inspection Repair System for Substrates BM-2150SR

BM-2100SI Plus.png
BM-2100SI Plus.png
  • Related Link - https://www.nissei.co.jp/
  • Special site - Product/service details - https://pr.mono.ipros.com/nissei/product/

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basic information

■Basic Specifications - Supported board size: 60×100 to 260×300 mm - Supported ball diameter: Φ50μm to φ300μm - Minimum ball pitch: 90 μm (φ50 μm ball) - Mechanical alignment accuracy: ±15μm - External dimensions: 1,750W×1,816D×1,740H mm *Excluding loader and unloader - Weight: Approximately 1,800 kg *For more details, please refer to the PDF document or feel free to contact us.

Price information

It may vary depending on the optional features, so please feel free to contact us.

Delivery Time

Please contact us for details

※Please feel free to contact us. (Negotiable)

Applications/Examples of results

Support for large and advanced packages for generative AI and data centers. *For more details, please refer to the PDF document or feel free to contact us.*

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Model number overview
BM-1150WR
BM-1310W
BM-2100SI Plus
BM-3500SI
CB-505
CB-700
AB-1000

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Micro Ball Inspection Repair System for Substrates BM-2150SR

Micro Ball Inspection Repair System for Substrates BM-2150SR

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日精

日精 本社

Machine elements and parts

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We respond flexibly and promptly to customer needs. In the "trading company" functional area, we are fully committed to providing truly attractive products and services that meet customer needs by collaborating with leading specialized manufacturers and utilizing advanced mechatronics technology to add value, thereby adapting to a highly information-oriented society. In the "mechanical parking equipment" business, we manufacture and install high-quality, environmentally friendly, and safety-conscious products to meet various customer needs. Based on our accumulated wealth of experience and technology, we provide 24-hour maintenance services through a nationwide service network, earning strong trust from our customers. The "freeze-drying equipment" business consistently develops next-generation "freeze dryers," including the sealed tube-type freeze dryer, which received the Minister of Economy, Trade and Industry Award from the Japan Industrial Machinery Manufacturers Association. We deliver and maintain both small-scale research and large-scale production equipment, and we also support the development of pharmaceuticals and food, establishing ourselves as an industry leader and receiving high praise. ◆ Locations Sapporo, Hitachi, Nagoya, Osaka, Fukuoka, Yamaguchi ◆ Overseas Subsidiary Thailand - Business activities: Sales of resin molded products, metal processed products, sheet metal, packaging materials, and electronic components.

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