Metal furnace | For hermetic sealing, brazing, and high vacuum heat treatment of semiconductor components

Supports airtight sealing and reliability improvement of semiconductor components in a high vacuum and high purity atmosphere.

In semiconductor components, ensuring long-term reliability requires airtightness during the sealing process and the suppression of oxidation and contamination. In particular, the sealing of ceramics and metals, brazing, annealing, and firing are influenced by the cleanliness of the furnace and the control of vacuum and atmosphere. Our metal furnace is constructed with metal components, making it easier to minimize the impact of dust and impurities from insulation materials, and it is suitable for heat treatment in a clean, high-purity atmosphere. Additionally, it can be easily reduced to high vacuum compared to conventional insulation furnaces, allowing for the sealing, brazing, oxidation prevention, and annealing of semiconductor components in vacuum, N2, Ar, and H2 atmospheres. ■ I want to consider the airtight sealing conditions for semiconductor components. ■ I want to stabilize the bonding and sealing quality of ceramics and metals. ■ I want to process in a high-purity atmosphere that suppresses oxidation and contamination. ■ I want to perform heat treatment in high vacuum, N2, Ar, and H2 atmospheres. ■ The vacuum level, cleanliness, and internal dimensions of off-the-shelf furnaces do not meet my requirements.

Industrial Furnace