From transportation, cleaning, etching, CMP, plating, to inspection. Coating that supports a wide range of processes in semiconductor manufacturing.
With the expansion of AI demand, the high operation and high precision of semiconductor manufacturing equipment are progressing, making it increasingly important to suppress surface-related troubles such as corrosion, adhesion, wear, and charging. Fluororesin coatings solve a wide range of challenges in processes such as transport, cleaning, etching, photomasks, CMP, plating, and inspection due to their five characteristics: chemical resistance, non-stick properties, slip properties, insulation, and purity. Yoshida SKT, as a pioneer in Teflon(TM) coatings, has a track record of over 2,000 companies and offers customized proposals that are optimal for customers' processes and equipment from hundreds of surface treatment technologies. Please download the materials to check specific application examples for each process.
Inquire About This Product
basic information
【Five Key Characteristics】 - Chemical Resistance: High chemical stability against various chemicals to suppress corrosion - Non-Stick: Low surface energy reduces adhesion and residue - Low Friction: Low friction characteristics achieve scratch prevention and stable sliding - Insulation/Electrostatic Measures: Insulation and electrostatic prevention designs can be tailored to applications - Purity: Extremely low levels of metal ion leaching are maintained 【Applicable Processes】 - Transport, cleaning, etching, photomask, CMP, plating, inspection, etc. 【Grades】 - General-purpose type, high-strength type, low-temperature processing type, etc., can be selected according to application
Price range
Delivery Time
Applications/Examples of results
【Example of Adoption Process】 - Wafer transport device: Prevents scratches and chipping, prevents body corrosion - Cleaning device: Prevents corrosion, prevents metal ion leaching - Etching device: Prevents corrosion, prevents deposition of particles - Photomask process: Improves release properties, prevents adhesion - CMP device: Prevents slurry adhesion, reduces metal contamination - Plating device: Protects plating solution, prevents precipitation - Inspection device: Prevents scratches, prevents sticking, prevents metal powder generation For more details, please download the materials or contact us.
catalog(2)
Download All CatalogsCompany information
To maximize the performance of manufacturing equipment and machine parts, Yoshida SKT derives the "optimal solution" tailored to our customers from hundreds of surface treatment technologies. - Decreased productivity due to adhesive troubles - Instability in product quality due to friction - Early deterioration of equipment due to corrosion We respond to these challenges in the manufacturing field with our extensive track record and reliable technical expertise. In 1963, we began fluoropolymer processing. In 1968, we signed a licensing agreement with DuPont (now Chemours), supporting manufacturing innovations for over 2,000 customers across various industries, from automotive to medical and aerospace. Furthermore, in 2024, we are focusing on the development of next-generation products, such as PFAS-free coatings, contributing to the advancement of sustainable manufacturing. With a three-base system in Nagoya, Tokyo, and Yamaguchi, we flexibly respond to both mass production and custom orders. Our consistent quality management system ensures that we deliver reliable quality. For solving challenges in the manufacturing field, trust the surface treatment experts at Yoshida SKT.








![[Semiconductor/Class 100 Compatible] 100% Water-Free Air Nozzle](https://image.mono.ipros.com/public/product/image/2116982/IPROS15202438644694791694.png?w=280&h=280)
