Piezo Nanopositioner for Semiconductor Manufacturing Equipment

Compact design with a 44 mm square. Piezo nano-positioning stage achieving a 120 µm operating range and 0.2 nm resolution.

In semiconductor manufacturing processes, precise positioning at the nanometer level is required during wafer processing and inspection stages. Especially in semiconductor processes where miniaturization is advancing, positioning accuracy significantly impacts product quality and yield. The P-611.XZ / P-611.2 is a piezo nano-positioner that achieves a maximum travel range of 120 µm and a high resolution of 0.2 nm, all within a compact design of 44 mm × 44 mm. With its high-precision flexure guide mechanism and PICMA(R) piezo actuators, it enables stable nano-positioning in semiconductor manufacturing and inspection equipment. 【Application Scenarios】 - Semiconductor manufacturing equipment - Wafer inspection equipment - Nano fabrication and micro fabrication equipment - Optical alignment equipment 【Benefits of Implementation】 - Improved yield through nano-level positioning - Enhanced inspection accuracy through high-precision positioning - Easier integration into equipment due to compact design - Stable process control due to high reproducibility

Piezoelectric DevicesencoderActuator