Verification of the cleanliness of fine joining solder paste.

Introducing a comprehensive cleanliness evaluation case using FT-IR and SEM-EDS! This highlights the importance of analysis in the cleaning of fine joints.

As electronic devices become more advanced and compact, the importance of fine solder paste in high-reliability fields such as power semiconductors, automotive, and industrial equipment is increasing. However, the growing demand for reduced electrode spacing, fine pitch, and low stand-off mounting has brought to light the risks associated with flux residue after soldering, which previously did not pose a problem, affecting insulation reliability and the quality of subsequent processes. For these reasons, there is an increasing number of situations where a decision must be made regarding whether or not to perform flux cleaning from the perspective of ensuring reliability, making the cleaning of high-performance solder paste and flux a new challenge. In this study, in collaboration with Japan Superior Co., we focused on the "high-reliability solder paste for fine bonding" developed by the company, examining the cleaning characteristics in fine bonding and verifying the usefulness of evaluation through FT-IR and SEM-EDS based on chemical analysis. *For detailed content of the article, please refer to the related link. For more information, feel free to download the PDF or contact us directly.*

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