Significantly reduce the usage of pharmaceutical solutions and pure water! Substantially shrink the footprint.
We would like to introduce the "Multi-Chamber Wafer Cleaning System" that we handle. The carrierless type supports 6-inch, 8-inch, and 12-inch wafers. With carrierless transport, it accommodates high-purity cleaning such as pre-deposition cleaning, and offers a lineup of 50, 25, and 13 wafers per batch. Equipped with loaders and unloaders compatible with cassettes or FOUPs, it allows for device configurations for processing with acidic, alkaline, and organic chemical solutions. Drying options include IPA drying, hot water lift & IR drying, and Marangoni drying. 【Features (Carrier Type)】 ■ Work sizes support wafers from 2 inches to 12 inches. ■ The number of transport cassettes per batch can be selected from 1 or 2 cassettes. ■ Device configurations for processing with acidic, alkaline, and organic chemical solutions are possible. ■ Drying options include spin dryer and IPA drying. ■ The number of cassettes for loaders and unloaders can be customized according to your needs. *For more details, please download the PDF or feel free to contact us.
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【Circuit Board Manufacturing Process】 ■ Post-lapping Cleaning ■ Alkaline Cleaning ■ Pre-Annealing Cleaning ■ Post-Edge/Polishing Cleaning ■ Final Cleaning *For more details, please download the PDF or feel free to contact us.
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【Device Process】 ■Development ■Metal/Nitride/Oxide Etching ■Resist Stripping ■Polymer Removal ■Pre-Diffusion Cleaning ■Pre-Film Formation Cleaning *For more details, please download the PDF or feel free to contact us.
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