Solving the film quality control of ITO films.
Our company offers a batch-type sputtering device (PVD) for ITO film deposition that can handle everything from research and development to small-scale production. This device enables the deposition of ITO thin films for optical semiconductor devices and electronic devices. The device is equipped with both DC and RF power supplies, allowing for the control of sputtering voltage during discharge, which results in low resistance (<200μΩ·cm) and high transmittance (>90%@400~700nm [ITO itself]) ITO thin films. Additionally, it supports film deposition from low to high temperatures (up to 350°C) and allows for control of crystallinity. It is suitable for deposition on semiconductor wafers and glass substrates, as well as on resin substrates such as PET and polycarbonate.
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basic information
<Features> - The characteristics of the ITO film can be precisely controlled by process parameters. - Film deposition is possible using a DC + RF hybrid method. - Gas inlet structure ensures uniformity of gas flow. - High throughput film deposition using inline sputtering method. - Resistivity: <200 μΩ·cm (varies with film thickness, etc.) - Transmittance: >90% (400~700nm) <Specifications> - Equipped with a loading chamber and a film deposition chamber. - Uses a pallet [330 × 330 mm²], capable of depositing films equivalent to 9 pieces of 4-inch wafers or 4 pieces of 6-inch wafers. - Equipped with a strong magnetic field cathode (three 5 × 15 inch rectangular cathodes). - DC power supply: 10kW. - RF power supply: 1kW. - Pallets can be set in the load lock chamber even during film deposition (achieving high throughput). - Equipped with a preheating mechanism. - Supports two or more types of process gas lines (e.g., Ar, O₂). - Compact footprint design (W 2190 mm × D 1360 mm).
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Applications/Examples of results
- Film characteristics such as resistivity and transmittance can be precisely controlled by film deposition process parameters (especially applied power, voltage, and current). This device provides a film deposition process that achieves high throughput and good film thickness distribution. - We recommend this for engineers facing challenges in film quality control when applying ITO films to optical devices (such as OLEDs, LCDs, touch sensors, solar cells, photodiodes, etc.) and optoelectronic devices (such as light confinement electrodes) not only in research and development but also in mass production processes.
Company information
Our company offers etching, film deposition, and cutting equipment utilizing plasma technology, as well as the sale of ICP, RIE, DSE, IBE, IBD, PECVD, HDPCVD, and HDRF F.A.S.T.-ALD equipment, along with customer service related to these devices. Plasma-Therm LLC, headquartered in Florida, USA, was established in 1974. Since its founding, it has been manufacturing and selling semiconductor manufacturing equipment utilizing plasma technology for 48 years. Please feel free to contact us for inquiries. ▼ Group company Corial official website https://corial.plasmatherm.com/en