Evaluation of the cleaning of organic residue remaining after sintering.

We conducted a cleaning evaluation using samples created under conditions that are likely to leave residues intentionally!

In the field of power semiconductors for automotive and industrial applications, the adoption of "sintering bonding" as a joining technology that achieves high resistance and high reliability against thermal stress is expanding, replacing solder bonding. Similar to no-clean soldering technology, sintering bonding is fundamentally designed for "no-clean" processes. However, the currently mainstream sintering bonding methods are performed under high temperature and high pressure conditions, which can lead to residues generated and adhered during the bonding process that may affect subsequent processes and long-term reliability. Cleaning is one potential solution to this issue. Although there is a "no-pressure" method for sintering bonding, its applications tend to be limited from the perspective of strength and reproducibility. Additionally, while it is residue-free, it is not "zero residue," so cleaning can also be a viable solution for achieving reliability. *For detailed content of the column, please refer to the related link. For more information, feel free to contact us.*

Other semiconductors