4/17 Webinar "Latest Trends in Semiconductor Packaging and Semiconductor Encapsulation Materials"

The encapsulating materials for advanced semiconductor packages require various characteristics such as low stress, moisture resistance, and high reliability. Guidelines for the design and evaluation of epoxy resins.

■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Techniques for Semiconductor Encapsulation Materials" ――With the advancement of chiplet and 3D packaging in semiconductors, there is a growing demand for more sophisticated material design for encapsulation materials. This seminar will provide a detailed practical perspective on the latest trends in semiconductor packaging, covering raw material selection, design techniques, and reliability evaluation of encapsulation materials. ■Date and Time: April 17, 2026 (Friday) 13:30–16:30 ■Target Audience: Designers of semiconductor encapsulation materials, engineers using semiconductor encapsulation materials, designers of epoxy resins and hardeners for semiconductor encapsulation materials ■Knowledge Gained from the Seminar: ・Trends in semiconductor packaging ・Knowledge about raw materials for semiconductor encapsulation materials ・Design techniques for semiconductor encapsulation materials, evaluation techniques for semiconductor encapsulation materials

Other semiconductorsEngineering PlasticsTechnical Seminar