[Book] AI Data Center, Heat Dissipation, Cooling of HPC (No. 2334)
2334 Heat dissipation cooling
[Available for trial reading] ~ TIM, immersion cooling, vapor chamber, water-cooled heat sink ~
Book Title: AI Data Centers, Heat Dissipation and Cooling Technologies for HPC －－－－－－－－－－－－－－－－－－－－－ ★ Comprehensive coverage of developments, challenges, and directions for high-frequency compatible semiconductor packaging! ★ How to achieve both dielectric performance and substrate processability －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book Application of heat dissipation materials for AI implementation and measures against rapid abnormal heat generation ■ Suppression of thermal strain using negative thermal expansion materials, measures against TIM deformation ■ Application of gap fillers to ultra-high temperature spots occurring at the semiconductor/heat sink interface ■ Achieving long-term durability and reduced thermal resistance using graphite sheets ■ Ensuring bonding reliability of power devices for data centers using Ag sintering bonding materials ■ Measurement techniques for thermal conductivity in the thickness direction, a major pathway for heat dissipation ■ Efficient prediction of the relationship between heat dissipation and electrical properties through simulation ■ Analysis of microscopic stresses inside devices and cracks at joints caused by heat damage Improving thermal transport efficiency through cooling systems and addressing excessive operation ■ Optimal design of complex cooling water flow paths and evaluation of boiling efficiency
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■ Plastic and metal components inside servers compatible with liquid immersion cooling ■ Surface treatment and improvement of cooling efficiency for continuously heat-generating internal substrates ■ Design of heat sinks considering "height," "thickness," and "spacing" for unbiased cooling of multiple GPUs and CPUs ■ Creating escape routes for heat sources with tower-type cooling devices for heat diffusion from horizontal to vertical －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Market trends in AI and generative AI data centers and the required heat dissipation and cooling technologies Chapter 2: Development of heat dissipation materials and components for electronic devices driving AI and HPC, trends, and responses to high heat density Chapter 3: Application of cooling technologies for stable operation of AI and generative AI, and responses to rapid heat generation Chapter 4: Design, analysis, and simulation of heat in advanced semiconductors and electronic devices Chapter 5: Heat dissipation and cooling technologies for devices and equipment equipped with AI and generative AI －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: March 31, 2026 ● Format: A4 size, 408 pages ● Authors: 40 contributors ● ISBN: 978-4-86798-145-0 －－－－－－－－－－－－－－－－－－－－－
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