4/24 Webinar: Fundamentals of Semiconductor Packaging Technology

A practical course where you can learn everything from the basics of semiconductor packaging to the latest trends all at once. Even beginners will receive a systematic explanation of the overall picture of equipment, materials, and methods.

■Title: "Fundamentals of Semiconductor Packaging Technology - From the Evolution of Packaging Forms to Manufacturing Processes, Equipment and Materials Used, and Latest Trends -" ――A practical course that allows you to learn everything from the basics of semiconductor packaging to the latest trends in one go. Even beginners can systematically understand the overall picture of equipment, materials, and methods. From the basics of processes, materials, and equipment to the latest trends such as CoWoS, FOWLP, and optoelectronic integration. ■ Date and Time: April 24, 2026 (Friday) 13:30 - 16:30 ■ Zoom Delivery (with materials) ■ Target Audience for the Seminar Engineers, sales, and marketing personnel who want to learn semiconductor packaging technology from the basics. ■ Knowledge Gained from the Seminar The evolution of semiconductor packaging technology and its background Semiconductor packaging manufacturing processes, materials, and equipment Cutting-edge packaging technologies and future directions

Other semiconductorsEngineering PlasticsTechnical Seminar