A practical course where you can learn everything from the basics of semiconductor packaging to the latest trends all at once. Even beginners will receive a systematic explanation of the overall picture of equipment, materials, and methods.
■Title: "Fundamentals of Semiconductor Packaging Technology - From the Evolution of Packaging Forms to Manufacturing Processes, Equipment and Materials Used, and Latest Trends -" ――A practical course that allows you to learn everything from the basics of semiconductor packaging to the latest trends in one go. Even beginners can systematically understand the overall picture of equipment, materials, and methods. From the basics of processes, materials, and equipment to the latest trends such as CoWoS, FOWLP, and optoelectronic integration. ■ Date and Time: April 24, 2026 (Friday) 13:30 - 16:30 ■ Zoom Delivery (with materials) ■ Target Audience for the Seminar Engineers, sales, and marketing personnel who want to learn semiconductor packaging technology from the basics. ■ Knowledge Gained from the Seminar The evolution of semiconductor packaging technology and its background Semiconductor packaging manufacturing processes, materials, and equipment Cutting-edge packaging technologies and future directions
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■Event Details Date and Time: April 24, 2026 (Friday) 13:30 - 16:30 Zoom broadcast (with materials)
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Tuition Fee - General: 44,000 yen (tax included) - Newsletter Member: 39,600 yen (tax included) ★【Newsletter Member Benefit】If two or more people apply at the same time and all applicants register as newsletter members, the participation fee per person will be half of the newsletter member price.
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We provide the latest industrial insights to our clients. By conducting market trend analysis, publishing technology‑related books and research reports, and organizing and managing seminars, we support research and development across a wide range of industries, with a primary focus on manufacturing. Our coverage spans diverse fields such as energy, batteries, chemicals, and biotechnology.
