[Sintering Material Compatible] Vacuum and Reduction Sintering Furnace <Maximum 615×615mm>
Large substrate-compatible vacuum and reducing atmosphere sintering furnace │ Capable of multi-purpose processing such as soldering, sintering bonding, and Cu via firing.
A large substrate-compatible model has been introduced for our vacuum reflow device, which boasts the industry's No. 1 track record! It can be utilized not only for conventional soldering but also for sintering bonding, via firing, and other multipurpose processing. For sintered material compatibility, gas introduction is possible without initial vacuum evacuation. It supports sizes up to 615×615mm while achieving the same temperature distribution performance within the substrate as previous models. We also accommodate various customizations. Please feel free to contact us.
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basic information
- Processing area: 615×615×H100mm - Temperature: 100–400℃ - Gas types: N2, formic acid, H2 - Options: chiller unit, formic acid concentration meter, formic acid removal device, hydrogen detector, etc. We can accommodate the specifications requested by the customer, including safety specifications.
Price range
Delivery Time
Applications/Examples of results
- Soldering of power devices - Soldering of various electronic components - Sintering bonding - Via firing - Sintering treatment of Cu ink material for circuit formation
Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.
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