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  6. CNT disperser for continuous dispersion of nanomaterials.

CNT disperser for continuous dispersion of nanomaterials.

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Inline solid-liquid mixing MHD disperser

last updated:May 14, 2026

澁谷工業 メカトロ統轄本部
澁谷工業 メカトロ統轄本部
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Supports CNT aggregation prevention and uniform dispersion. Assists in stabilizing the quality of conductive material slurry through continuous processing.

This is a solid-liquid mixing system for conductive material slurries utilizing CNT dispersers. Carbon nanotubes (CNTs) tend to agglomerate easily, and their conductivity and slurry quality are significantly affected by dispersion conditions. This system addresses CNT agglomeration through high-shear dispersion and stabilizes quality through uniform dispersion. Additionally, inline continuous processing reduces dispersion variability, improves reproducibility, and stabilizes production. It also accommodates process design that includes powder supply, dispersion, defoaming, and transfer, allowing for system proposals that combine inline dispersers, batch dispersers, static mixers, etc., according to material properties and viscosity conditions. It is utilized for improving process challenges in applications involving nano materials such as CNT conductive material slurries, battery materials, electronic materials, and high-performance materials. It is capable of supporting everything from lab tests to scale-up and mass production line construction.

    Emulsifier/DisperserPowder Supply DeviceDispersion/emulsification equipment/homogenizer
カーボン混合液.jpg

CNT disperser for continuous dispersion of nanomaterials.

カーボン混合液.jpg
カーボン混合液.jpg インライン固液混合パイロットプラント.jpg IKA+shibuya .png 4.PNG 分散トラブル.png
  • The process design for CNT dispersion is here, supporting powder supply and continuous dispersion line construction.
  • Special site - Product/service details - https://pr.mono.ipros.com/shibuya/product/

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basic information

Supports continuous processing systems using CNT dispersers. High shear dispersion achieves measures against CNT aggregation and uniform dispersion. Depending on material properties and viscosity conditions, we can propose systems that combine inline dispersers, batch dispersers, static mixers, and more. We also accommodate line design that includes powder supply equipment, degassing equipment, tanks, piping, and temperature control equipment. This is utilized in process design for nanomaterial applications such as CNT conductive material slurries, battery materials, electronic materials, and high-performance materials. We can provide consistent support from lab evaluation to pilot verification and mass production line construction.

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Applications/Examples of results

CNT conductive material slurry, battery materials, electronic materials, and high-functionality materials are adopted in nanomaterial applications. CNTs tend to aggregate easily, and their conductivity and slurry stability can vary significantly depending on the dispersion conditions. This system addresses CNT aggregation issues through high-shear dispersion and ensures uniform dispersion through continuous processing. It is also utilized to improve process challenges such as clumping during powder feeding, sedimentation, viscosity increase, and re-aggregation. It can accommodate the construction of dispersion lines that include powder supply, degassing, and transfer, as well as considerations for scaling up from lab conditions to mass production conditions.

Detailed information

  • カーボン混合液.jpg

    Example of dispersion testing for CNT conductive material slurry. CNTs tend to aggregate easily, and the dispersion conditions significantly affect conductivity and slurry quality. This system addresses CNT aggregation issues and achieves uniform dispersion through high-shear dispersion and inline continuous processing. Additionally, by optimizing powder input conditions, shear conditions, and circulation conditions, it reduces re-aggregation and dispersion inconsistencies. It is utilized to improve process challenges in applications involving nanomaterials such as battery materials, electronic materials, and high-functionality materials.

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Inline solid-liquid mixing dispersion system

Inline solid-liquid mixing dispersion system

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Inline solid-liquid mixing and dispersion system for battery materials

Inline solid-liquid mixing and dispersion system for battery materials

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Inline solid-liquid mixing and dispersion system for slurry

Inline solid-liquid mixing and dispersion system for slurry

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What causes clumping when adding powder? Design points for preventing and addressing poor dispersion.

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In dispersion processes, the occurrence of agglomerates (clumps) during powder addition, which cannot be resolved in subsequent dispersion stages, is a common issue in many settings. The cause of this is that the powder does not wet uniformly in the liquid, leading to the formation of localized high-concentration areas. These agglomerates are also referred to as "fisheyes," and due to their internal unwetted structure, they are difficult to break apart. Once an agglomerate forms during powder addition, liquid has difficulty penetrating its interior, resulting in only the outer layer being wetted, which makes it hard for the internal particles to be disintegrated. Additionally, depending on the addition position and speed, the powder may float on the liquid surface or remain stagnant without following the flow within the equipment, promoting the formation of agglomerates. Particularly under conditions of high viscosity or high solid content, the low fluidity makes it challenging to achieve uniformity in the initial dispersion stage, leading to a higher likelihood of agglomerates remaining. Such agglomerates may not be completely resolved even with strong shear in subsequent processes, causing variations in the quality of the final product and introducing foreign substances. To prevent the formation of agglomerates, it is crucial to improve wettability during powder addition, ensure appropriate addition positions and flow design, and optimize the initial dispersion. By performing shear and mixing simultaneously right after addition, as in inline powder addition and simultaneous dispersion, it is possible to suppress the formation of agglomerates and achieve stable dispersion quality.

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Stable supply of fine powder through vacuum degassing and loss-in-weight control.

Why can't powders be supplied stably? - What causes supply irregularities in low bulk density powders?

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In low bulk density powders and fine powders, issues such as "unstable supply," "pulsation," and "bridging without falling" frequently occur. Particularly with CNTs, carbon black, and flake powders, the particles tend to entangle easily and have low flowability, making stable quantitative supply difficult with conventional powder feeding methods. When powder supply becomes unstable, instantaneous concentration fluctuations occur, significantly affecting the dispersion quality, viscosity, and conductivity in subsequent processes. In practice, even problems that appear to be "poor dispersion" often have their causes on the powder supply side. Moreover, in low bulk density powders, bridging, rat-holing, and supply pulsations due to air entrapment are likely to occur within the hopper, and simply relying on feeder capacity may not resolve these issues. To achieve stable supply, it is crucial to design the entire process, including hopper design, supply methods, transport conditions, and feeding methods, according to the characteristics of the powder. Our company offers a solid-liquid mixing process that includes quantitative supply using loss-in-weight feeders and integration with inline dispersion devices. By designing the entire process from powder supply to dispersion as a cohesive unit, we support the establishment of stable manufacturing conditions even for high-performance materials.

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澁谷工業

澁谷工業 メカトロ統轄本部

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Our company is headquartered in Kanazawa City, Ishikawa Prefecture, and has sales offices and factories both within and outside the prefecture. We focus on the bottling business, which involves filling beverages and other products, and we are expanding into various fields such as solid-liquid mixing and dispersion systems, laser processing machines (including fiber lasers and CO2 lasers), and semiconductor assembly equipment (such as taping machines, multifunctional test handlers, ball mount machines, and bonders). Please feel free to contact us if you have any inquiries.

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