An overview of optical-electrical fusion technology and CPO technology, which are attracting attention from data centers, next-generation communication, and power consumption, covering everything from optical devices to packaging and applications.
Key Points of This Book ★ The rapid expansion of AI data centers brings attention to photonic integration and CPO technology An overview of the latest trends from scale-up/scale-out networks to implementation trends and roadmaps ★ Thorough explanation of core devices such as optical interconnects, polymer optical waveguides, lasers, and modulators Understanding the characteristics and differentiation of various materials and methods ★ Understanding Co-Packaged Optics (CPO)! Organizing key points of implementation technology related to design and packaging technology Detailed explanation of challenges faced in the field such as chiplets, thermal design, and optical coupling, along with solution approaches ★ Comprehensive coverage of development foundational technologies from materials and components to measurement, evaluation, and simulation Systematizing essential knowledge for practical work, including reliability testing, multiphysics analysis, and standardization trends ★ Rich examples of applications such as AI data centers, optical transceivers, and optical computing A comprehensive view of the technology's "current status and future outlook," including social implementation, international trends, and future prospects
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basic information
Publication: June 2026 Price: - Book version: 61,600 yen (including tax at 10%) - Book version + PDF version set: 72,600 yen (including tax at 10%) Format: B5 size, 318 pages, ISBN 978-4-86502-313-8 ★ Please be sure to check the specifications for the paid supplementary PDF version (CD-ROM) - The PDF version cannot be purchased separately. It is a paid supplement for those who purchase the book. - The entire text of the book is included, and some figures and tables are printed in black and white in the book, but are in color in the PDF version. - The URLs in the text are prepared for printing, and may not link properly. Additionally, some links may be broken, so please be aware of this in advance. - Copying of the text is not allowed. Printing is not allowed. Each product has an individual password set for the file data. - A serial number is assigned for each purchaser, which is noted on each page (unauthorized use by anyone other than the purchaser is prohibited). - The password is attached to the CD-ROM. * This product is a copyrighted work, and reproduction, distribution, and unauthorized copying are strictly prohibited.
Price information
List Price: - Book version: 61,600 yen (including tax (10% consumption tax)) - Book version + PDF version set: 72,600 yen (including tax (10% consumption tax)) - The PDF version cannot be purchased separately. It is a paid supplement for those who purchase the book. - For other specifications of the PDF version, please check the basic information specifications before applying.
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P2
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※*For more details, please contact us* *Publication scheduled for June 2026*
Applications/Examples of results
Authors: 18 Chapter 1: Growing Expectations for Photonic-Electronic Integration Technology / CPO Technology and Roadmap Chapter 2: Core Technologies of Optical Devices and Specific Application Circuits Chapter 3: Packaging Technology Chapter 4: Trends in Materials and Material Technologies Chapter 5: Measurement and Evaluation Technologies Chapter 6: Application Examples For more details, please refer to the related website.
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The information organization aims to contribute to the development of the industry through technical seminars on chemistry, pharmaceuticals, electronics, machinery, environment, cosmetics, food, etc., as well as the publication of technical books, correspondence courses, and DVDs that record seminars.
