Thermal conduction and thermal stress analysis

basic information

<Analysis Content> Temperature distribution analysis Heat conduction analysis Steady-state thermal analysis Transient thermal analysis <Target> Mechanical components Electronic devices Heat sinks Piping systems Tanks and containers Various structures Equipment with heat sources <Evaluation Items> Temperature distribution Maximum temperature Temperature gradient Temperature change history

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Applications/Examples of results

<Applications> Temperature confirmation of heating components Consideration of heat dissipation design Prediction of temperature rise Preliminary examination of thermal deformation evaluation Verification of material selection Impact assessment during design changes <Examples of Achievements> Cooling characteristics during resin molding Thermal deformation of electronic circuit boards Thermal deformation of steel towers Thermal conductivity calculations for culture tanks Thermal conductivity and thermal stress calculations for large exhaust silencers for factories Thermal conductivity and thermal stress calculations for acrylic windows Thermal conductivity and thermal stress calculations for semiconductors