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  6. Thermal conduction and thermal stress analysis

Thermal conduction and thermal stress analysis

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last updated:Jun 19, 2026

構造計算テクノロジー
構造計算テクノロジー
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Visualize the temperature distribution and verify issues caused by heat in advance.

Temperature distribution analysis is a numerical evaluation method for temperature changes and heat transfer within components and structures. Our company uses the finite element method (FEM) to analyze heat conduction from heat sources, heat dissipation effects, temperature distribution, and more, to conduct thermal design and structural integrity assessments. It can be utilized for understanding temperature rise, evaluating heat dissipation performance, and examining thermal deformation.

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Thermal conduction and thermal stress analysis

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basic information

<Analysis Content> Temperature distribution analysis Heat conduction analysis Steady-state thermal analysis Transient thermal analysis <Target> Mechanical components Electronic devices Heat sinks Piping systems Tanks and containers Various structures Equipment with heat sources <Evaluation Items> Temperature distribution Maximum temperature Temperature gradient Temperature change history

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Applications/Examples of results

<Applications> Temperature confirmation of heating components Consideration of heat dissipation design Prediction of temperature rise Preliminary examination of thermal deformation evaluation Verification of material selection Impact assessment during design changes <Examples of Achievements> Cooling characteristics during resin molding Thermal deformation of electronic circuit boards Thermal deformation of steel towers Thermal conductivity calculations for culture tanks Thermal conductivity and thermal stress calculations for large exhaust silencers for factories Thermal conductivity and thermal stress calculations for acrylic windows Thermal conductivity and thermal stress calculations for semiconductors

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構造計算テクノロジー

構造計算テクノロジー

Testing, Analysis and Measurement

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Our company supports designers who are troubled by issues such as "lightweight and strength" of products and equipment like automobiles, electronics, and machine tools, as well as "deformation and stress due to heat" and "fatigue failure due to vibration," with 15 years of product design experience and 30 years of structural analysis expertise. With the motto of providing advanced structural analysis at a low cost, we aim to be a "small company with unique technology."

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