Non-destructive open defect analysis system
Microsanj『irSCOPE EZ100A OpenTest』
Identify the disconnection point without opening the package!
There is no longer a need for physical package opening (decapping) or destructive testing to identify troublesome "open defects (disconnections)." The 'irSCOPE EZ100A OpenTest' from Microsanj is an innovative solution that uses proprietary advanced thermal image analysis technology to quickly and completely non-destructively detect open defects in IC chips and complex package interiors. By intentionally inducing minute thermal excitation with special test signals, a highly sensitive infrared (IR) sensor captures the thermal response, instantly revealing the disconnection points. This dramatically shortens the failure analysis (FA) process, which previously took several days to weeks, contributing to faster development and improved yield.
![Open-Test[1].png](https://image.mono.ipros.com/public/product/image/2058922/IPROS17640690486219790220.png?w=280&h=280)
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basic information
Completely non-destructive identification of open defects (disconnections) No cumbersome sample preprocessing or physical unsealing is required. Our proprietary technology "OpenTest" allows for pinpoint visualization and identification of disconnection points from the outside of the package. Dramatic reduction of failure analysis (FA) cycle Quickly screen for anomalies without relying on destructive testing or traditional complex analysis methods. This significantly reduces the time and cost associated with analysis. Support for macro-scale thermal distribution measurement It incorporates the functionality of the general-purpose IR system "EZ100A," enabling wide-field thermal mapping of the entire package and electronic circuit boards (PCBA), as well as the identification of hotspots. It serves dual purposes with one device. Intuitive and seamless analysis software Works in conjunction with Microsanj's dedicated software that automates analysis. Without complex settings, it directly identifies defect locations from the acquired thermal images and assists in report generation.
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Applications/Examples of results
Analysis of open defects (disconnections) in semiconductor devices and IC packages Non-destructive testing in the Quality Assurance (QA) and Failure Analysis (FA) departments Screening for continuity defects in printed circuit boards (PCBs) and assembly modules Rapid debugging and reliability evaluation during new device development
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Company information
Antenna Technology Co., Ltd. is a company that primarily designs, manufactures, and sells various antennas for wireless LAN and data telemetry. We specialize in custom development tailored to the individual needs of our customers and are capable of supporting a wide range of radio transmission and high-frequency transmission technologies. Please feel free to contact us if you have any requests.
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