Leave it to us for all kinds of test pattern wafers for 3D NAND flash memory.
We provide foundry wafer manufacturing services at various wafer levels, starting with test pattern wafers for 3D NAND flash memory. We have a track record of rare wafer deposition services, such as multilayer epitaxial wafers of Si epi and SiGe epi. We respond according to your requests.
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basic information
3D NAND Flash Memory Test Pattern Wafer <Film Formation Specifications> 3µm Photoresist Film 3kÅ PE-CVD SiON 3µm Amorphous Carbon 250Å PE-TEOS SiO2/250Å PE-CVD SiN 70 pairs (100 pairs) Si Substrate <Patterning/Etching> Mask Type: Channel Hole, Line & Space Size: Channel Hole 150–500nm, Line & Space 40–500nm Process: Photoresist Film: Exposure • Development • Etching PE-CVD SiON Film: Etching Amorphous Carbon Film: Etching Photoresist Pattern: Ashing PE-CVD SiON Pattern: Etching 70 pairs PE-TEOS SiO2/PE-CVD SiN Film: Etching
Price information
A dummy wafer will be needed for process evaluation, so the price varies depending on the quantity. However, we can accept orders starting from one piece.
Delivery Time
P4
※It will take about 4 weeks for manufacturing and approximately 1 week for packaging, shipping, and delivery.
Applications/Examples of results
We have a track record with semiconductor manufacturing equipment manufacturers, as well as chemical and gas manufacturers in the semiconductor supply chain.
Company information
Our company is engaged in the business of semiconductor silicon wafers and silicon-related products. We outsource various semiconductor process factories in the United States and provide a range of silicon wafer processes. Additionally, we offer silicon materials for solar power generation elements and have commercialized small power supplies using solar power generation elements. Please feel free to contact us if you have any inquiries.
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