Output high-speed signals directly without going through the PCB!
In the field of IoT connectivity, high-speed and stable data transmission between devices is essential. In particular, real-time exchange of sensor data and control signals directly impacts the responsiveness and reliability of the system. Traditional PCB wiring is susceptible to signal attenuation and noise, which can become a bottleneck for high-speed operations. Our OCP-compliant NearStack Substrate connector addresses these challenges by allowing high-speed signals to be output directly on the chip substrate, bypassing the PCB. 【Use Cases】 - Edge computing devices - High-density implementation boards - High-speed data communication modules 【Benefits of Implementation】 - Improved signal quality - Reduced footprint - Enhanced overall system performance
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【Features】 - Supports 56 Gbps PAM-4 / 112 Gbps PAM-4 - Direct chip-to-board wiring on the board connector - Direct placement of PCB plugs on the board surface 【Our Strengths】 Lester Corporation is an information platform that broadly supports electronics manufacturing, from handling semiconductors and electronic components to system solutions. We respond to diverse needs in the IoT field and provide optimal solutions.
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Lester Corporation supports the manufacturing of electronics that underpin our daily lives through a variety of services, including the handling of semiconductors and electronic components. Additionally, as a system supplier for electronic devices, we propose optimal solutions across a wide range of fields such as broadcasting, video production, local governments, schools, and healthcare. Furthermore, amid growing concerns about global environmental issues like global warming, we contribute to reducing the environmental burden and realizing a sustainable society through business activities such as the deployment of mega-solar projects and the provision of energy management services.
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