Free Webinar: Latest Laser Drilling Technology at VIA Hall

Laser Drilling at VIA Hall: Webinar Video by PI USA

In this webinar, we will introduce the latest technology related to laser drilling of VIA holes, which is essential for achieving high-bandwidth communication and miniaturization of devices. Experts in lasers and motion control will explain important technical information to engineers and managers in the fields of semiconductors, photonics, optics, and medical device manufacturing. The main topics will include representative materials and shapes used for VIA, as well as critical issues such as control of hole shapes and high precision during high-speed processing. Additionally, we will learn methods to overcome these challenges by utilizing fixed optical systems, advanced motion control, and synchronization technology between lasers and motion. Through practical examples, including drilling holes in glass wafers, we will demonstrate how these technologies can lead to measurable results. Finally, we will touch on new technologies such as XL SCAN, 3D error correction, and hybrid piezo motion, which will contribute to faster and more precise manufacturing in the future. *Changing the subtitle setting to Japanese will automatically display Japanese subtitles.

Laser marker