September 29 Webinar "Semiconductor Packaging and Encapsulation Technology"

Systematically explain the latest trends such as chiplets and 3D packaging, the basics of epoxy resins, the design and evaluation of encapsulants, and next-generation materials!

■Title: "Latest Trends in Semiconductor Packaging and Design/Evaluation Technologies for Semiconductor Encapsulation Materials" --- This seminar systematically explains encapsulation materials that respond to evolving semiconductor packages such as chiplets and 3D packages, covering everything from raw materials like epoxy resins, hardeners, and additives to design and evaluation. It also introduces technological trends for next-generation encapsulation materials, including low dielectric, high thermal conductivity, and optoelectronic integration. 【Knowledge Gained from the Seminar】 - Types of semiconductor packages and the latest trends - Characteristics of wire bond, flip chip, wafer level, and advanced packages - Molding methods such as transfer and compression molding - Raw materials like epoxy resins, hardeners, and inorganic fillers - Required properties of encapsulation materials and material design technologies - Design for heat resistance, moisture resistance, and low stress - Evaluation techniques for moisture absorption reflow, heat cycles, high temperature and humidity, etc. - Next-generation encapsulation materials for low dielectric, high thermal conductivity, and optoelectronic integration 【Target Audience for the Seminar】 - Engineers involved in the design and use of semiconductor encapsulation materials - Designers of epoxy resins and hardeners for semiconductor encapsulation materials - Individuals interested in semiconductor packages and encapsulation materials

Other semiconductorsOther polymer materialsTechnical Seminar