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  5. Printed Circuit Board
  6. The explosion of sensors and the limitations of silicon semiconductors in Society 5.0.

The explosion of sensors and the limitations of silicon semiconductors in Society 5.0.

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last updated:Oct 02, 2026

 Sakurai Graphic Systems Corporation
Sakurai Graphic Systems Corporation
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Solving technical challenges for large-scale deployment of IoT sensors! We propose low-cost dataization for society as a whole.

We will introduce the technical challenges and solutions related to the large-scale deployment of IoT sensors required in Society 5.0. In a society where constant measurement in various locations is demanded, the demand for disposable temperature sensors is rapidly increasing, and the number of sensors is expanding into unknown territories. For areas that cannot be addressed by traditional rigid and expensive silicon substrates, we propose low-cost data collection for society as a whole using inexpensive and flexible sensor substrates. 【What the new society demands】 ■ Bendable ■ Lightweight ■ Thin ■ Large area ■ Disposable ■ Ultra-low cost *For more details, please download the PDF or feel free to contact us.

    Printed Circuit Board
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The explosion of sensors and the limitations of silicon semiconductors in Society 5.0.

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【What Silicon Semiconductors Excel At】 ■ High-speed computation ■ AI ■ CPU ■ Memory ■ High-precision control ■ High reliability *For more details, please download the PDF or feel free to contact us.

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**Reasons for the Increase in Sensors** - Wearables: To measure a person's condition 24 hours a day - Automobiles: Increased measurement items due to EVs and autonomous driving - Smart Factories: Monitoring the entire equipment for predictive maintenance - Infrastructure: Continuous sensing for monitoring aging - Agriculture: Area-wide monitoring of fields - Logistics: Traceability of temperature, humidity, and impact *For more details, please download the PDF or feel free to contact us.*

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Expanding Product Design Possibilities with Flexible Circuit Boards - What is [FHE] that Enhances Design Freedom and Creates New Applications?

Expanding Product Design Possibilities with Flexible Circuit Boards - What is [FHE] that Enhances Design Freedom and Creates New Applications?

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August 5-6 | Explanation of the possibilities for product design expanded by flexible substrates.

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We will hold a free webinar themed on "Flexible Hybrid Electronics (FHE)," a next-generation electronics technology that integrates semiconductor technology and printing technology. 【Event Overview】 ■ Date: August 5 (Wed) and August 6 (Thu), 2026, 14:00 - 14:45 ■ Format: Recorded distribution (Zoom) ■ Duration: Approximately 30 minutes 【Recommended for】 - Those involved in new business or new product development in the semiconductor and electronic device industry - Those interested in flexible substrates and next-generation packaging technologies - Those who want to learn about printed electronics and FHE - Engineers and researchers from electronic components, materials, and packaging-related companies - Those who want to understand trends in the next-generation electronics market 【What you will learn in this webinar】 - Basic knowledge of flexible hybrid electronics - Benefits of integrating semiconductor and printing technologies - Latest global market trends and future potential - Product development examples utilizing flexible substrates - New possibilities for next-generation device development ★ How to Register ★ Pre-registration (free) is required to participate in the webinar. Click the "Details & Registration Button" below!

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Sakurai

Sakurai Graphic Systems Corporation

Printing Industry

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Sakurai Graphic Systems Corporation continues to provide cutting-edge technology both domestically and internationally as a global company in silk screen printing. In particular, we boast a top-level market share in the field of screen printing and respond to various requests. By leveraging our advanced technology and experience, we are able to offer production equipment tailored to your company's needs, continuously evolving day by day.

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