Fully automatic laser welding machine for semiconductor packaging
LW1089
Ideal for semiconductor packaging! A clean laser welding machine that does not produce spatter.
In the semiconductor packaging industry, precise bonding of tiny components is required. Especially as density increases, reliable welding technology is essential for maintaining product performance. Improper welding can lead to poor connections and reduced product lifespan. Our fully automatic laser welding machine applies years of developed bond head technology to achieve clean welding with minimized spatter and fumes through high-precision control and reliable laser focus at each welding point. This addresses the high-precision bonding needs in semiconductor packaging. 【Application Scenarios】 - Welding of copper terminals in semiconductor power modules - Welding of aluminum busbars between cells and busbars in BEV battery modules - Precision bonding of high-density mounting substrates 【Benefits of Implementation】 - Clean welding environment due to reduced spatter and fumes - Improved reliability through high-precision control at each welding point - Flexibility of the welding head to accommodate steps and tilts - Increased process efficiency by eliminating the need for clamps
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basic information
**Features** - Touchdown detection function - Maximum hold-down force of 120N - Maximum deep access of 100 mm - Automatic recognition of welding points using ring light and image processing optics - Ventilation function for welding spots - Air-cooled chiller available (optional) **Our Strengths** Hesse Mechatronics Japan Co., Ltd. is the Japanese subsidiary of Hesse GmbH based in Germany, developing, manufacturing, and selling wedge bonders for fine wires, thick wires, and ribbons, ball bonders, ultrasonic welding machines, and laser welding machines. We provide equipment to a wide range of industries, including the semiconductor industry, automotive, eco-friendly vehicles such as BEVs, and aerospace, with over 400 companies and more than 5,000 units delivered. With our long-standing experience and technical expertise, we offer consistent support from the development stage to mass production, providing innovative solutions that meet customer demands. We can respond to various bonding requests in a one-stop manner.
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Applications/Examples of results
Welding of copper terminals for automotive and industrial power modules. Development and prototyping of battery modules for BEVs. Process verification before the adoption of the model LW2095 for mass production of BEV battery packs. *For more details, please refer to the PDF document or feel free to contact us.*
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Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
