[For Semiconductors] Fully Automatic Ultrasonic Welding Machine Smart Welder
SW1089
Ideal for lead frame welding! High-speed, high-quality ultrasonic welding machine.
In the semiconductor industry, the reliable welding of lead frames significantly affects product reliability. Particularly in semiconductor devices that require fine wiring and high-density mounting, precise and stable welding technology is essential. Improper welding can lead to electrical connection failures and reduced product lifespan. The fully automatic ultrasonic welding machine, Smart Welder, addresses these challenges by achieving high-quality lead frame welding through high-precision image recognition and flexible welding settings. 【Usage Scenarios】 - Welding of lead frames and terminals in semiconductor packaging - Welding of narrow-pitch, high-density lead frames - Welding that minimizes damage to fragile devices 【Benefits of Implementation】 - Improvement in welding quality and yield - Increased productivity and cost reduction - Adaptability to various lead frame shapes
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【Features】 - Fully automatic welding in a large area of 392 mm x 870 mm - High-precision detection of welding points and θ-axis control using image recognition - Narrow pitch deep access with elongated tool shape and high-precision image recognition - Zero gap at welding points through touchdown and protection for brittle devices - Welding setting programming using multiple phases and parameter creation for each welding point 【Our Strengths】 Hesse Mechatronics Japan Co., Ltd. is a 100% subsidiary of Hesse GmbH based in Germany, developing, manufacturing, and selling advanced joining equipment such as wire bonders, ultrasonic welders, and laser welders. We have a track record of over 400 units delivered in Japan and provide customer-oriented support from the development stage to mass production. Our strength lies in offering one-stop solutions that meet the needs of customers across a wide range of industries, including semiconductors, automotive (BEV/HEV), and aerospace.
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Welding of copper terminals, rivets, pins, and sockets for automotive and industrial power modules. Welding of lead frames and substrates. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
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