Achieving flux cleaning for ultra-small gaps of 30μm or less!

Are you struggling with flux remaining in extremely small gaps? Micro Clean ECO and Markless ECO improve cleaning quality for high-density mounting.

Delivering cleaning quality to the world beneath the chip at 30μm. In recent years, it has become common for the gap beneath the chip in semiconductor package substrates and high-density mounting substrates to be less than 30μm. In such narrow spaces, conventional cleaning agents may not penetrate into the flux residue, potentially leading to decreased insulation reliability and prolonged failure analysis due to insufficient cleaning. Microclean ECO and Markless ECO utilize a unique cleaning mechanism that not only dissolves flux residue but also swells and detaches it. Additionally, a water-based alcohol rinse quickly penetrates fine gaps, efficiently removing residual cleaning agents and ionic components. By improving cleaning quality beneath the chip and in narrow gaps, we contribute to enhancing yield and reducing defect risks for high-reliability products.

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