Si3N4 AMB substrates have a maximum thermal conductivity of 130 W/m·K. AlN AMB and DBC substrates are also available. Samples can be provided in as little as 2 weeks from an order of 5 pieces.
We handle AMB substrates and DBC substrates made of Si3N4 and AlN. The Si3N4 AMB substrate has a thermal conductivity of 40 to 130 W/m·K (with 150 W/m·K currently under development), which offers superior heat dissipation compared to DBC substrates (24 to 28 W/m·K), and it also boasts high strength and excellent thermal shock resistance. It is ideal for applications such as EV/HEV, railways, industrial inverters, and IGBT/SiC modules. We will select the optimal substrate based on your drawings from a wide range of products, including those currently under patent application. We can provide samples in as little as 2 weeks, starting from 5 pieces. Please feel free to contact us with your requests.
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basic information
【Specifications】 ■Si3N4 AMB substrate Thermal conductivity: 40 to 130 W/m·K (150 W/m·K is under development) Thermal shock resistance: Excellent (high-strength Si3N4) ■DBC substrate Thermal conductivity: 24 to 28 W/m·K Thermal shock resistance: Standard ■AlN AMB substrate Please contact us 【Support】 Minimum order quantity: From 5 pieces Sample delivery time: As short as 2 weeks We will select the optimal substrate based on your drawings.
Price range
Delivery Time
Applications/Examples of results
【Applications】 EV/HEV, railways, industrial inverters, IGBT/SiC modules (DBC substrates are for industrial and consumer use) 【Achievements】 Power semiconductor manufacturers, prototype manufacturers, OSAT (domestic and international)
Company information
Hi-Fi Crew LLC is a company specializing in substrates, materials, and equipment in the power device industry. We meet the needs of customers seeking high reliability and high performance through the provision of high-quality AMB substrates and DBC substrates, among other ceramic substrates. Additionally, we offer a wide range of materials and equipment required in the manufacturing process of power devices, accommodating short delivery times and low prices.
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