Countermeasures for the expansion of micro-cracks in wafers: Ozone + fine bubble cleaning.
Fabozon Series
Are you struggling with the expansion of micro-cracks during ultrasonic cleaning? Switching to fine bubble cleaning can reduce surface damage and improve cleanliness, and adding ozone will further assist in the cleaning process.
We propose fine bubble cleaning, which does not use ultrasound, to address the issue of small surface cracks expanding during ultrasonic cleaning. Our customers have reported that after switching, no expansion of cracks has been observed, and the products are finished cleaner than before. In a configuration that uses ozone in conjunction, fine bubbles promote gas-liquid contact and utilize the oxidative effect of ozone to remove organic contaminants and resist. We support the creation of processes that balance consideration for surface damage and cleaning performance. Nakajima Bussan will propose cleaning conditions and equipment configurations based on the material of the wafers, surface films, and existing micro-cracks. We will compare changes in cracks and residual contaminants after cleaning to confirm the effects on quality.
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basic information
【Features】 - A fine bubble cleaning method that does not use ultrasonic irradiation. - Assists in the removal of organic contaminants and resist through the oxidative action of ozone. - Basic components: Ozone generator + bubble generation device + cleaning tank and circulation system. - Concentration, flow rate, temperature, and time are set according to material, membrane composition, and contamination. - Assesses metal elution and dust generation of contact parts based on the use of pure water and ultra-pure water. 【Application Scenarios】 - Processes where the expansion of micro-cracks, occurrence of defective products, and residual contaminants after cleaning are issues. 【Effects of Introduction】 - In customer cases, no expansion of cracks was observed after switching, and the finish improved. - Supports process improvements aimed at suppressing surface damage and enhancing cleaning quality. 【Our Strengths】 Nakajima Bussan leverages the knowledge gained from the development and sales of fine bubble nozzles to propose optimal systems tailored to on-site applications and equipment. We emphasize a simple and practical configuration that combines general-purpose equipment, helping to reduce introduction costs and maintenance burdens while supporting stable operations.
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Applications/Examples of results
【Target Fields】 Semiconductor wafer manufacturing / Precision cleaning of silicon substrates / Removal of organic contaminants and resist / Cleaning considerations for thin and brittle substrates 【Case Studies and Public Research from Our Customers】 - Before the change: Defects occurred due to the amplification of micro-cracks on the surface caused by ultrasonic fine vibrations, leading to an increase in defect rates. - After the change: Switched to fine bubble cleaning, with no observed crack amplification, resulting in a cleaner finish than before. - Public research: Reported improvements in the resist removal effect on silicon wafers using ozone microbubbles. *The before-and-after cases are based on interviews with our customers. The public research is a repurposing of reports on ozone use under different testing conditions.
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Company information
Our company engages in a wide range of operations, from handling industrial products in general to factory process development. Additionally, as a specialized dealer of Daikin Industries products, we have established a system that focuses on after-sales support during repairs. Please feel free to contact us first.
