Suppressing micro-cracks through ultrasonic cleaning. Supporting the improvement of power semiconductor voltage resistance with fine bubbles and ozone.
In the power semiconductor industry, it is essential to eliminate minute defects on the wafer surface and maintain high cleanliness to ensure the voltage withstand performance of products. In particular, tiny cracks that occur during the cleaning process can affect the reliability and voltage withstand characteristics of the products, making cleaning technologies that minimize surface damage indispensable. Our proposed fine bubble cleaning method efficiently removes organic contaminants and resist by using physical cleaning without ultrasound, while also utilizing ozone to reduce the load on the surface. By balancing the suppression of surface damage and cleaning performance, we support the creation of high-quality processes. 【Application Scenarios】 - Processes where the expansion of minute cracks due to ultrasonic cleaning is a concern - Improvement of voltage withstand failures caused by residual contaminants after cleaning - Resist removal and surface cleaning processes 【Benefits of Implementation】 - Suppression of surface damage through a cleaning method that does not use ultrasound - Enhanced removal performance of organic contaminants and resist through the use of ozone - Stabilization of finished product quality by suppressing crack expansion
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basic information
【Features】 - Adopts a fine bubble cleaning method that does not use ultrasonic irradiation. - Assists in the removal of organic dirt and resist through the oxidative action of ozone. - Basic components: Ozone generator + bubble generation device + cleaning tank and circulation system. - Concentration, flow rate, temperature, and time can be set according to material, membrane composition, and dirt. - Evaluates metal elution and dust generation of contact parts based on the use of pure water and ultra-pure water. 【Our Strengths】 Nakajima Bussan leverages the knowledge gained from the development and sales of fine bubble nozzles to propose optimal systems tailored to on-site applications and equipment. We emphasize a simple and practical configuration that combines general-purpose equipment, supporting stable operations while minimizing installation costs and maintenance burdens.
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Applications/Examples of results
【Target Fields】 Semiconductor wafer manufacturing / Precision cleaning of silicon substrates / Removal of organic contaminants and photoresist / Cleaning considerations for thin and brittle substrates 【Customer Case Studies and Public Research】 - Before the change: Defects occurred due to the amplification of micro-cracks on the surface caused by ultrasonic fine vibrations, leading to an increase in defect rates. - After the change: Switched to fine bubble cleaning, with no observed crack amplification, resulting in a cleaner finish than before. - Public research: Reported improvements in the removal effect of photoresist on silicon wafers using ozone microbubbles. *The before-and-after cases are based on interviews with our customers. The public research is a reference to reports on ozone use under different testing conditions.
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Company information
Our company engages in a wide range of operations, from handling industrial products in general to factory process development. Additionally, as a specialized dealer of Daikin Industries products, we have established a system that focuses on after-sales support during repairs. Please feel free to contact us first.
