Ideal for small-batch, multi-variety production! Equipment with excellent operability that does not require operator skills.
The "System DE35-ST" is a semi-automatic die sorter that is versatile, primarily designed for tray packing of good chips, chip appearance inspection, epoxy die bonding, flip chip, and front and back inspection (optional specifications). It is well-suited for prototype lines and small-batch, diverse production, and can accommodate various chip sizes through tool changes. 【Features】 ■ Suitable for small-batch, diverse production ■ Can accommodate various chip sizes through tool changes ■ Excellent operability that does not require operator skills ■ No need for readjustment during the next operation after turning off the power switch at the end of work ■ The movement of the output stage is automatically determined by simply entering the used tray number *For more details, please refer to the external link or feel free to contact us.
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basic information
【Specifications (Excerpt)】 ■ Chip size: 0.15 mm to 25.4 mm ■ Wafer size: Compatible with up to 6 inches / Compatible with up to 8 inches ■ Tray used: 2-inch tray / 4-inch tray ■ Accuracy: ±127 microns (measured value ±50 microns) ■ Die pickup weight: 10 g or less (adjustable) ■ Throughput: 700 to 1300 / hour (depending on chip size) ■ Equipment size: 830 (D) × 1120 (W) × 762 (H) mm ■ Equipment weight: 70 kg * For more details, please refer to the external link or feel free to contact us.
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Company information
Hugle started in 1969 as the Far East branch of the American company Hugle Industries, a world leader in semiconductor manufacturing equipment during the early days of the semiconductor industry. Taking advantage of this first-mover advantage, it established a foundation as an independent manufacturer in 1971. Since then, in the ever-evolving world of semiconductors and flat panels such as LCDs, we have consistently developed and provided numerous innovative products ahead of the times. What we particularly want to highlight is our unwavering commitment to originality, focusing on equipment and devices related to a "pure and clean production environment," which are not commonly addressed by others and significantly impact quality. As you know, semiconductor technological innovation aims for limitless miniaturization, which inevitably requires "ultra" levels of cleanliness and purity in production and inspection environments. Therefore, we have prominently embraced the philosophy of "Clean & Quality," striving to refine our available technologies to realize a more advanced production environment.
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