Non-contact tweezers for 300mm high refractive index glass wafers
Non-contact tweezers type 300
Non-contact tweezers for 300mm high refractive index glass wafers
Transfer and handle the φ300mm high refractive index glass wafer non-contact using tweezers through manual operation, without bending, applying stress, or causing scratches and dirt.
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basic information
A non-contact tweezers that grips wafers and chips without contact by using gas jets, allowing for manual valve operation, with a high refractive index glass wafer of φ300mm and a thickness of 20μm. Since it is non-contact, it does not scratch the wafer and allows for easy transportation without contact.
Price information
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Applications/Examples of results
Non-contact tweezers for gripping, transporting, cutting, and flipping high refractive index glass wafers with a thickness of 20μm and a diameter of 300mm.
Company information
Manufacturing of non-contact transport devices and application devices for wafers, liquid crystal glass substrates, PDPs, ceramics, printed circuit boards, FPC substrates, films, paper, cloth, etc., using our patented non-contact transport device "Float Chuck" based on the vertical gas jet method developed by our company.
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