Cure device
The cure device is a clean cure apparatus that overheats the lead frame after die bonding from both the top and bottom while purging with N2 hot gas simultaneously. This equipment automatically performs a series of operations from directly receiving the lead frame from the die bonder to feeding it into the cure furnace, storing it in a magazine, and discharging the magazine.
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basic information
The cure device is a clean cure apparatus that overheats the lead frame after die bonding from both the top and bottom while purging with N2 hot gas simultaneously. This equipment automatically performs a series of operations from directly receiving the lead frame from the die bonder, feeding it into the cure furnace, to storing it in the magazine and discharging the magazine.
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Applications/Examples of results
It refers to a curing furnace that applies heat after die bonding, where IC chips are attached to a frame called a lead frame in the final stage of semiconductor manufacturing, to cure the adhesive (such as silver paste).
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【Corporate Philosophy】 - Challenge - Trust - Gratitude Based on the above philosophy, while enhancing our comprehensive responsiveness to customers using our equipment, we will make proposals focusing on: - Advancement - Diversification - Price emphasis.
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