Vacuum soldering device (vacuum reflow device)
Vacuum soldering device (vacuum reflow device)
The standard vacuum reflow device with the number one domestic track record! <Sample tests now accepting applications>
By melting solder in a vacuum, voids within the solder are eliminated. Additionally, by preheating in a hydrogen atmosphere or formic acid atmosphere, flux-free soldering is achieved. We take pride in being the number one in domestic achievements as a standard machine in the power device manufacturing process. With a wide range of options and a rich lineup of equipment, we propose the optimal device for our customers. <Recipient of the Excellence Award at the 2nd Monozukuri Japan Awards>
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basic information
【Features】 1. Reflow is possible in N2, H2, and formic acid atmospheres. 2. High-quality soldering is achieved through concentration control of H2 and formic acid. 3. Low oxygen concentration (below 5ppm). 4. Supports not only rapid heating and rapid cooling but also step heating and slow cooling. 5. A wide range of options available from batch to medium and large-scale production. 【Main Specifications】 Processing dimensions: W310×D320×H150mm (batch type) Processing temperature: 100℃ to 450℃, MAX 500℃ Atmosphere: N2, H2, formic acid, or vacuum Vacuum system: Achievable pressure of 1Pa ◎ For more detailed information, please refer to the catalog or contact our sales office directly.
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Applications/Examples of results
Automotive power devices, industrial power devices, Peltier elements.
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Company information
Shinko Seiki, as a technology-driven manufacturer, leverages the numerous know-how accumulated particularly in the field of vacuum equipment to deliver innovative products that meet user needs. In recent years, the company has also been challenging cutting-edge fields such as electronics and new materials, aiming to develop truly valuable hardware and software through the advancement of distinctive technologies and their organic integration.