Plasma CVD equipment
● Despite its compact design, it can accommodate 5 pieces of 3-inch wafers, 3 pieces of 4-inch wafers, and 1 piece of 8-inch wafers. ● Up to 100-step processes are possible. ● Equipped with a load lock chamber, enabling stable processes. ● Features an interlock mechanism for various safety measures.
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basic information
The PD-220NL is a load-lock type device developed based on the extensive delivery record of the plasma CVD equipment 'PD-220 series'. This device features a compact design while having an effective substrate diameter of φ220mm. It is intended for the formation of various silicon-based thin films (such as Si3N4, SiO2, etc.) and can accommodate a wide range of applications from cutting-edge research to semi-mass production.
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Applications/Examples of results
●Formation of silicon nitride film ●Formation of silicon oxide film ●Formation of amorphous silicon film ●Other thin film formation
Company information
We excel in the technology of thin film formation and processing at the nano to micro level, and we are well-regarded for providing equipment and technology for both research and development applications as well as production purposes. Additionally, we specialize in the optoelectronics field, particularly in light sources (LEDs and semiconductor lasers), which are expected to see market expansion in the future.
![[Data] Silicon processing data using the non-bosch process](https://image.mono.ipros.com/public/product/image/c8d/2000499800/IPROS02347582528443700539.png?w=280&h=280)
![[Data] - Example of ICP Etching Process for MicroLEDs](https://image.mono.ipros.com/public/product/image/514/2000499814/IPROS23208611525336548350.png?w=280&h=280)
