Supercritical fluid cleaning and drying equipment

It is possible to clean and dry without damaging microstructures.

By replacing the conventional "process of substituting with liquefied carbon dioxide" with the "process of substituting with supercritical carbon dioxide"... ● By preheating the liquefied carbon dioxide pumped into the chamber, it is introduced as a low-viscosity supercritical fluid, allowing for cleaning and drying with minimal damage to nanometer-level fine structures. ● The absence of temperature cycles for cooling and heating the chamber enables cleaning and drying at a constant temperature, which allows for a reduction in processing time. ● By programmatically controlling the heater, automatic pressure adjustment valve, and pump, efficient depressurization from the rinsing liquid using supercritical fluid to atmospheric pressure can be achieved without creating a closed system.

Other semiconductor manufacturing equipment